Intel Laminar RM1 Copper Heat Sink Aluminum CPU Cooler with Fan for LGA1700 CPU - OEM

Intel M23901-001 CPU Copper Cooler Heat Sink with Fan for LGA1700 92mm Fan 2500rpm OEM 65W TDP

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Free Thermal Grizzly Aeronaut Thermal Paste - Worth £8 MSRP - LN143471

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Scan code: LN128435 Manufacturer code: M23901-001

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Order now and get it tomorrow, Fri 9th Feb

£5.99

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Product Overview
This fan is only for LGA1700 up to 65W TDP Intel CPU
This fan cannot be used on any K or KF Alder Lake models of CPU
4pins Connector
Features
Brand Intel (OEM)
Power Connector Type 4-Pin
Voltage 12 Volts
Wattage 65 watts TDP
Compatible Devices Desktop
Maximum Rotational Speed 2500 RPM

This fan is only for LGA1700 up to 65W TDP Intel CPU
This fan cannot be used on any K or KF Alder Lake models of CPU
4pins Connector

Specifications

Cooler Specifications
Edition	Laminar RM1
Cooler Form Factor	Radial Heatsink
Heatpipes
Cooler Features	Aluminium Fins Copper Base
Socket Compatibility
Max. TDP	65W

Fan Specifications
Included Fan Configuration	1 x 92mm
Fan Edition
PWM Fan	Yes
Fan Bearing Type
Fan Colour
LED Lighting
Fan/Pump Connectors	1 x 4-pin
Max. Fan Speed	3150 rpm
Max. Fan Airflow
Max. Air Pressure
Max. Sound Level	29 dBA

Materials
Cooler Materials	Aluminium / Copper
Included TIM (Thermal Interface Material)

Dimensions & Weight
Heatsink/Radiator Dimensions
Total Dimensions	100 x 47 x 100 mm (WxHxD)
Weight	350 g

Additional Information
Scan Code	LN128435
Model Number	M23901-001
GTIN	037182132489

TekSpek Guides

Intel Branding Part I
Date Issued: 1st Jul 2009

Intel’s been on a mission of late. That mission revolves around grouping and standardising key technologies under various banners that are designed to ensure hardware compatibility and consumer ease of use. We’ll take a closer look at three such technologies that fall under the headings of Centrino, Viiv, and vPro, respectively.

Intel Core 2 Duo (Conroe)
Date Issued: 20th Oct 2008

The purpose of this TekSpek is to delineate the publicly known features of Intel’s next generation desktop microarchitecture. Codenamed Conroe and officially titled Intel Core 2 Duo, it’s loosely based on the current mobile Yonah (Core Duo) underpinnings.

Chassis Airflow
Date Issued: 20th Oct 2008

The modern PC is potentially a mass of heat output and heat production hot spots. With CPUs rated at more than 100W of heat output, single graphics boards carrying similar ratings (and people want to run two!), multiple hard drives the norm, lots of memory and mainboards covered in heatpipes to combat toasty core logic and PWM circuits, a PC appreciably warming up a room when it’s working hard is no joke.

Overclocking
Date Issued: 20th Oct 2008

This TekSpek explains why you’d want to overclock your graphics board, the risks in doing so and how you can go about doing it.

Core 2
Date Issued: 14th Jun 2008

There’s been a lot of hype about Intel’s Core 2 recently, even since they launched Core in fact. Words like Conroe, Badaxe and Allendale have been flying around. The bottom line is that Core 2 is the name of Intel’s latest line of CPUs, based on a new micro-architecture, designed for speed and efficiency.

System Noise Reduction
Date Issued: 5th Mar 2007

Anybody who has been near their share of computer systems will appreciate that not all systems make the same amount of noise. There are a number of reasons for why this is so. Firstly, a computer makes noise for different reasons. Generally, anything mechanical is going to make noise.

Intel Laminar RM1 Copper Heat Sink Aluminum CPU Cooler with Fan for LGA1700 CPU - OEM